The Summit II High-Power, Modular, Soft-Fail Redundant SSPA systems from Advantech Wireless Technologies are high power, wide bandwidth, all outdoor ruggedized systems that allow operation with multiple carriers and outstanding linearity.
The new modular Summit II system is comprised of 4, 8 or 16 amplifiers that are phase combined into a single amplifier that can generate extremely high levels of RF output power – up to 10,000 watts or more. Summit II is available in C, X, Ku and S-band architectures.
